CEVA and Brodmann17 Partner to Deliver 20 Times more AI Performance for Edge Devices
MOUNTAIN VIEW, Calif., Oct. 18, 2017 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and Broadmann17, a developer of patent-pending deep learning technology, today announced a partnership aimed at accelerating the deployment of deep learning computer vision in mainstream applications. Through the partnership, CEVA and Brodmann17 bring an order of magnitude increase in performance and power efficiency for deep learning in edge devices compared to the leading GPU-based implementations.
The push towards widespread adoption of Artificial Intelligence (AI) in consumer devices continues at a relentless pace. However, cloud-based deep learning on battery-powered devices is plagued with issues, including latency, security and the need for a constant, reliable internet connection. Implementing the intelligence on the device itself – or on the edge – eliminates all of these issues. Highly efficient computer vision processors are necessary to meet the stringent power requirements and specialized deep learning software is crucial in delivering the accuracy and performance needed for cloud-based systems.
Targeting embedded devices, Brodmann17 has developed a specialized deep learning technology for visual recognition aimed at edge-based artificial intelligence. Using patent-pending techniques, Brodmann17's deep learning architecture generates smaller neural-networks that are faster and more accurate than any other network generated on the market. Through the collaboration with Brodmann17, licensees of the CEVA-XM platforms and their customers will be able to use Brodmann17's deep learning object detection that achieves state of the art accuracy on the CEVA-XM at a rate of 100 frames per second. This equates to 170% better performance than the same software running on the NVIDIA Jetson TX2 AI Supercomputer. Comparing to the popular combination today of Faster-RCNN algorithm over NVIDIA TX2 it is an improvement of 20 times (2000%) in frames per second.
"Our patent-pending deep learning vision software is a perfect fit for the many CEVA customers and OEMs using CEVA-XM platforms to add intelligence to their devices," said Adi Pinhas, CEO of Brodmann17. "This first-of-its-kind combination of hardware and software achieves real-time performance that supports multi-cameras with a single DSP or higher resolutions."
"To truly maximize the performance and capabilities of AI in mass-market devices, it requires not just application-specific hardware like our CEVA-XM platforms, but also neural networks that are trained to be run efficiently on the edge embedded devices," said Ilan Yona, vice president of the vision business unit at CEVA. "Brodmann17's deep learning software provides the capability to create extremely light, accurate and flexible networks, trained from the ground up with embedded in mind. We're delighted to partner with them and bring their unique capabilities to the CEVA-XM ecosystem."
Brodmann17 will present and demonstrate their deep learning software together with the CEVA-XM4 imaging and vision platform at the CEVA Technology Symposium Series in China and Taiwan, October 23rd to October 27th, 2017. Visitors to the symposium can meet computer vision experts from CEVA and Brodmann17 at these events. For more information on how to register, please visit the Symposium website at http://events.ceva-dsp.com/symposium-2017-en/.
About Brodmann17
Brodmann17 develops first-in-class deep learning vision software for everyday devices. We partner with automotive, security, robotics, smartphones and other device manufactures to make consumer devices cloud-free and truly autonomous. Our proprietary deep learning algorithm technology increases overall speed and efficiency in processors, while eliminating the need for Graphic Processing Units (GPU)- making it the most lightweight deep learning vision solution on the market. The company was founded in 2016 and is backed by lool Ventures, SamsungNext and Sony Innovation Fund. Visit us at http://www.brodmann17.com and follow us on YouTube and LinkedIn.
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging, computer vision and deep learning for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi (802.11 a/b/g/n/ac up to 4x4) and serial storage (SATA and SAS). Visit us at www.ceva-dsp.com
|
Ceva, Inc. Hot IP
RivieraWaves Bluetooth 4.2 low energy Baseband Controller, software and profiles
RivieraWaves 802.11ac (Wi-Fi 5) 1x1 & 2x2 MAC & modem
Full eNB-IoT Release 14 IP solution with multi-constellation GNSS support for Io ...
Imaging and Computer Vision Processor
Multifunctional DSP Architecture for High-Performance, Low-Power Audio/Voice/Sen ...
Related News
- CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture
- BrainChip and NVISO Partner on Human Behavioral Analytics in Automotive and Edge AI Devices
- Perceive Corporation Launches to Deliver Data Center-Class Accuracy and Performance at Ultra-Low Power for Consumer Devices
- Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices
- CEVA Introduces New AI Inference Processor Architecture for Edge Devices with Co-processing Support for Custom Neural Network Engines
Breaking News
- UMC, eMemory, and PUFsecurity Announce Successful Silicon-Proven Secure Embedded Flash IP
- Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller
- Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics
- Flex Logix Hires Barrie Mullins as Vice President of Product Management
- Synaptics Selects Allegro DVT's VVC Compliance Streams
Most Popular
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
- IAR Systems enable Visual Studio Code extensions to meet developer demands
- sureCore's ultra-low memory technologies enable designers to create the reality of the metaverse
- Intento Design Secures Third Round of Investment to Accelerate Its Commercial Deployment
- MosChip Technologies Appoints Semiconductor Industry Veteran, DVR Murthy As "Vice President of Strategic Initiatives" to Implement and Execute Expanded Solution Offerings
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |