Flex Logix Names Fan Mo Technical Director Of FPGA CAD Software Development
Embedded FPGA Leader Expands Software Team to Accelerate Customer Growth
MOUNTAIN VIEW, Calif. – Nov. 6, 2017 – Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that Fan Mo has joined the company as technical director, FPGA CAD software engineering. Reporting to Flex Logix’s senior VP & co-founder Cheng Wang, Fan will be responsible for the technical and architecture direction for the company’s growing FPGA CAD software team. Fan’s skills and deep experience will help support Flex Logix’s rapidly growing customer base, particularly customers with the largest and most demanding eFPGA applications.
“We are honored to have someone with Fan’s experience and technical depth in large FPGA CAD software join Flex Logix to help drive software technical roadmap and implementations,” said Cheng Wang, senior VP, engineering. “eFPGA is clearly becoming a defacto standard for chip design and we will be able to better support the growing number of customers with a stronger CAD software development team.”
Fan has over a dozen years of technical experience in FPGA and structured ASIC synthesis, placement and routing, starting first with Synplicity then with Synopsys after they acquired Synplicity. He has worked on high-performance place-and-route for many generations of Virtex FPGAs, timing-driven largescale placement algorithms and global routing algorithms, as well as Synthesis. Fan studied at Fudan University in Shanghai for his Bachelors and Masters and completed his PhD work at UC Berkeley, where he studied novel approaches to placement and routing.
About Flex Logix
Flex Logix, founded in March 2014, provides solutions for reconfigurable RTL in chip and system designs using embedded FPGA IP cores and software. The company's technology platform delivers significant customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps, and bringing greater flexibility to customers’ hardware. Flex Logix has secured approximately $13 million of venture backed capital, is headquartered in Mountain View, California and has sales rep offices in China, Europe, Israel, Japan, Taiwan and Texas. More information can be obtained at http://www.flex-logix.com.
|
Flex Logix Technologies, Inc. Hot IP
Related News
- Flex Logix Names Valy Ossman Technical Director, Solutions Architecture
- Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
- Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America
- Brian Philofsky Joins Flex Logix as Senior Director of Solutions Architecture
- Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |