Few Surprises as Intel, GloFo Detail Process Technologies
Dylan McGrath, EETimes
12/7/2017 02:01 AM EST
SAN FRANCISCO — Intel detailed plans to use cobalt for some interconnect layers at 10nm, while Globalfoundries offered specifics on how it will utilize extreme ultraviolet (EUV) lithography for the first time at the 7nm node in dueling process technology presentations at one of the most hotly anticipated sessions at the IEEE International Electron Device Meeting (IEDM) here.
Intel will use cobalt in on the bottom two layers of its 10nm interconnect to get a five to 10 fold improvement in electromigration and a two-fold reduction in via resistance. It represents the first time a chip maker has detailed plans to introduce cobalt — a brittle metal long considered a promising dielectric candidate — in a process, according to G. Dan Hutecheson, chairman and CEO of VLSI Research.
E-mail This Article | Printer-Friendly Page |
Related News
- Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
- Samsung and GLOBALFOUNDRIES Forge Strategic Collaboration to Deliver Multi-Sourced Offering of 14nm FinFET Semiconductor Technology
- Intel's Ambitious Process Roadmap
- QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process
- Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
Breaking News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India