eVaderis Completes Tape-Out of Innovative MRAM-Based, Memory-Centric MCU Demonstrator for Next-Generation IoT Applications
Start-up company will license the underlying IP for MRAM-based optimized subsystems and memory compilers
Grenoble, France – 2 January 2018 – eVaderis, a semiconductor IP start-up that provides design solutions to improve the functionality, power efficiency and performance of its customers’ semiconductor chips, has successfully demonstrated a fully functioning design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics.
By incorporating the latest perpendicular, spin-transfer-torque magnetoresistive random-access memory (STT-MRAM) technology from international R&D institute Imec, Beyond Semiconductor’s new MCU can achieve non-volatile operation with high-speed read/write and low voltage. In addition, the device is designed for manufacturability using GLOBALFOUNDRIES’ 40-nm low-power CMOS production process.
“The tape-out of this innovative MRAM-based, memory-centric MCU demonstrates our proficiency in disruptive, non-volatile embedded IP design and flow for low-power, digital devices,” said Virgile Javerliac, deputy CEO and head of technology and marketing at eVaderis. “We now plan to license the underlying IP to semiconductor manufacturers making sub-40-nm chips.”
“Power consumption is still the key challenge for any battery-powered device,” said Matjaz Breskvar, Beyond Semiconductor’s CEO. “We have been working with eVaderis since the company’s inception to jointly realize a vision of battery-powered, always-on devices with unprecedented energy efficiencies.”
Three megabits (3 Mb) of on-chip memory are fully distributed across the system though different instances, covering different functions such as working memory, configuration, state retention, code execution and data storage. eVaderis’ memory IP architectures are built to be compiler-friendly, helping chip makers to achieve faster time to market.
eVaderis’ innovative memory-centric architecture based on embedded MRAM technology allows a MCU to achieve power, performance and functional gains at the system and software levels. These gains include for instance energy-efficient, non-volatile checkpointing or normally-off/instant-on operation with near zero latency boot.
About eVaderis
Founded in 2014, eVaderis is the first company worldwide to offer innovative IP solutions based on new, disruptive embedded memory technologies including MRAM and RRAM. The company provides highly competitive products and design services to meet the challenges of producing advanced non-volatile memories, compilers, logic libraries and processor subsystems, paving the way for new chip design paradigms. eVaderis is a member of GLOBALFOUNDRIES’ FDXcelerator™ Partner Program. For more information about the company and its products, please visit www.evaderis.com.
About Beyond Semiconductor
Beyond Semiconductor is addressing challenges of systemic complexity in today’s electronic devices, empowering its customers to create new and secure experiences for end users. Initially known for its processor expertise, Beyond quickly gained acceptance among top semiconductor companies and evolved into a company leveraging processing, software and system-wide view competence to provide its customers with secure and effectively designed IP, ASIC and dedicated hardware security products. For more information: www.beyondsemi.com.
|
Related News
- Axelera AI and Kudelski IoT Partner for Next-Generation Edge Intelligent Ecosystem
- Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform
- GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
- sureCore announces successful tape-out of cryogenic IP demonstrator
- Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |