SoC-e IP Cores support new Xilinx UltraScale+ devices
January 29, 2018 -- Xilinx UltraScale/UltraScale+ architectures comprise high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.
All the IP Cores in the SoC-e product portfolio have a version which is supported in devices with UltraScale and UltraScale+ architecture. This devices enhance the performance of SoC-e’s products. The combination of SoC-e’s IP Cores with the performance of these architectures allows the designer to implement leading-edge networking, synchronization and cryptographic technologies for critical systems:
- HSR-PRP Switch IP Core
- Managed Redundan Switch IP Core
- Managed Ethernet Switch IP Core
- Unmanaged Ethernet Switch IP Core
- Multiport TSN Switch IP Core
- MultiSync IP Core
- PreciseTimeBasic IP Core
- 1588Tiny IP Core
- IRIGtimeM IP Core
- IRIGtimeS IP Core
Additionally, some of UltraScale+ version of these IP Cores are already used in the design included in the SMARTmpsoc Brick, the updated version of SoC-e’s reference board.
For more information about SoC-e’s IP Core support in UltraScale/UltraScale+ architectures, you can contact us through the web form or writing us to info@soc-e.com
|
Related News
- Enea Adds Support for Xilinx Zynq UltraScale+ MPSoC Devices
- Xilinx Collaborates with Fujitsu to Support 5G Deployments in the US
- High Performance Channel Coding Solutions on Xilinx Zynq UltraScale+ RFSoC Devices
- Xilinx Announces the World's Highest Performance Adaptive Devices for Advanced ADAS and AD Applications
- Xilinx Extends its Breakthrough Zynq UltraScale+ RFSoC Portfolio to Full sub-6GHz Spectrum Support
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |