Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Arteris FlexNoC Interconnect IP Powers DJI Drones
Semiconductor interconnect IP enables power-efficient processing in semi-autonomous aerial imaging devices
CAMPBELL, Calif. — March 27, 2018 — Arteris IP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect intellectual property, today announced that drones created by DJI, the world’s leader in civilian drones and aerial imaging technology, use Arteris FlexNoC interconnect IP to accelerate on-aircraft processing while conserving battery life and increasing maximum flight time.
Arteris FlexNoC interconnect IP is a key ingredient in the semiconductor systems used within DJI drones because it enables faster and higher-bandwidth processing while reducing battery drain for longer flight times. Arteris technology helps DJI create a longer-lasting and more enjoyable flight experience.
“We are committed to supporting industry leaders like DJI in developing autonomous and semi-autonomous systems. We are proud to help DJI provide supercomputer-like processing in the world’s most efficient aerial imaging platforms,” said K. Charles Janac, President and CEO of Arteris IP. “This success is proof of our technologies’ cost, performance and power consumption benefits.”
About Arteris IP
Arteris IP provides system-on-chip (SoC) interconnect IP to accelerate SoC semiconductor assembly for a wide range of applications from automobiles to mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Samsung, Huawei / HiSilicon, Mobileye (Intel), Altera (Intel), and Texas Instruments. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, as well as optional Resilience Package (functional safety) and PIANO automated timing closure capabilities. Customer results obtained by using the Arteris IP product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com
|
Arteris Hot IP
Related News
- Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
- SCALINX and Arteris Partner on Advanced Communications Innovation
- Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications
- Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |