Cadence: Last Holdout for Vision + AI Programmability
Junko Yoshida, EETimes
4/11/2018 10:45 AM EDT
Cadence Design Systems, Inc. might have found the secret recipe for success in an increasingly hot AI processing-core market by promoting a suite of DSP cores that accelerate both embedded vision and artificial intelligence.
The San Jose-based company is rolling out on Wednesday (April 11) the Cadence Tensilica Vision Q6 DSP. Built on a new architecture, the Vision Q6 offers faster embedded vision and AI processing than its predecessor, Vision P6 DSP, while occupying the same floorplan area as that of P6.
The Vision Q6 DSP is expected to go into SoCs that will drive such edge devices as smartphones, surveillance cameras, vehicles, AR/CR, drones, and robots.
The new Vision Q6 DSP is built on Cadence’s success with Vision P6 DSP. High-profile mobile application processors such as HiSilicon’s Kirin 970 and MediaTek’s P60 both use the Vision P6 DSP core.
E-mail This Article | Printer-Friendly Page |
|
Cadence Hot IP
Related News
- Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference
- Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
- Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs Targeting High-End and Always-On Applications
- Efinix Completes Trion FPGA Family for Edge Computing, AI/ML and Vision Processing Applications Using Cadence Digital Full Flow Solution
- Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process