SEMI Reports 2017 Global Semiconductor Materials Sales of $46.9 Billion
MILPITAS, Calif. — April 24, 2018 — SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that in 2017 the global semiconductor materials market grew 9.6 percent while worldwide semiconductor revenues increased 21.6 percent from the prior year.
According to the SEMI Materials Market Data Subscription, total wafer fabrication materials and packaging materials totaled $27.8 billion and $19.1* billion, respectively, in 2017. In 2016, the wafer fabrication materials and packaging materials markets logged revenues of $24.7 billion and $18.2 billion, respectively, for 12.7 percent and 5.4 percent year-over-year increases.
For the eighth consecutive year, Taiwan, at $10.3 billion, was the largest consumer of semiconductor materials due to its large foundry and advanced packaging base. China solidified its hold on the second spot, followed by South Korea and Japan. The Taiwan, China, Europe and South Korea markets saw the strongest revenue growth, while the North America, Rest of World (ROW) and Japan materials markets experienced moderate single-digit growth. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.)
2016 and 2017 Regional Semiconductor Materials Markets (US$ Billions)
Region | 2016** | 2017 | % Change |
Taiwan | 9.20 | 10.29 | 12% |
China | 6.80 | 7.62 | 12% |
South Korea | 6.77 | 7.51 | 11% |
Japan | 6.76 | 7.05 | 4% |
Rest of World | 5.39 | 5.81 | 8% |
North America | 4.87 | 5.29 | 9% |
Europe | 3.03 | 3.36 | 11% |
Total | 42.82 | 46.93 | 10% |
Source: SEMI, April 2018
Note: Summed subtotals may not equal the total due to rounding.
* Includes ceramic packages and flexible substrates
** 2016 data have been updated based on SEMI’s data collection programs
The Materials Market Data Subscription (MMDS) from SEMI provides current revenue data along with seven years of historical data and a two-year forecast. The annual subscription includes four quarterly updates for the materials segment reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, South Korea, and China). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and leadframes. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers).
About SEMI
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
|
Related News
- SEMI Reports 2017 Global Semiconductor Equipment Sales of $56.6 Billion
- SEMI Reports 2016 Global Semiconductor Materials Sales of $44.3 Billion
- SEMI Reports 2014 Global Semiconductor Materials Sales of $44.3 Billion
- SEMI Reports 2013 Global Semiconductor Materials Sales of $43.5 Billion
- SEMI Reports 2012 Global Semiconductor Materials Sales of $47.1 Billion
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |