Foundries expect 30+ tapeouts this year
Rick Merritt, EETimes
4/27/2018 00:31 AM EDT
SANTA CLARA, Calif. — Globalfoundries announced it has 36 design wins for its 22nm fully depleted silicon-on-insulator process, more than a dozen of which should tape out this year. Rival Samsung said it expects to tape out more than 20 chips in its 28nm FD-SOI process this year.
The latest data points were taken as welcome signs that FD-SOI is finally gaining traction as a lower cost and power alternative to FinFETs.