Cadence Shortens Automotive Verification Closure with New Verification IP for UFS 3.0, CoaxPress, and HyperRAM
Three VIP offerings enable designers to quickly achieve compliance with the latest protocols
SAN JOSE, Calif., 03 May 2018 --Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced three new Verification IP (VIP) offerings: the industry’s first CoaXPress VIP offering for high-speed imaging, the industry’s first HyperRAM high-speed memory VIP offering, and a VIP offering for the new JEDEC Universal Flash Storage (UFS) 3.0 specification. All three enable early adopters of these standards to begin designing with the new specifications immediately, ensuring compliance with the standard and achieving the fastest path to IP and system-on-chip (SoC) verification closure.
For more information on the new Cadence® VIP offerings, please visit http://www.cadence.com/go/vipU for UFS 3.0, http://www.cadence.com/go/vipC for CoaXPress, and http://www.cadence.com/go/vipH for HyperRAM.
“Designers of SoCs for automotive applications face unique challenges of sustainability and reliability together with growing real-time processing needs that drive interfaces and memory standards innovation,” said Michal Siwinski, vice president of product engineering and management, System and Verification Group at Cadence. “These three new VIP offerings add to the total Cadence Verification Suite to help engineers easily achieve compliance with the latest standards for rapid high-quality design of innovative new automotive electronics.”
VIP for UFS 3.0
The UFS 3.0 specification doubles the throughput bandwidth from 1333MB/s in UFS 2.1 to 2666MB/s in UFS3.0 to address the growing bandwidth, low power and responsiveness requirements of advanced automotive and mobile designs. The UFS 3.0 Memory Model provides a full-stack solution, including support for MIPI® Unified Protocol (UniProSM) 1.8 and MIPI M-PHYSM 4.1, with comprehensive coverage model and test suite. This VIP offering also utilizes Cadence TripleCheck technology for fast testing of all requirements for the specification.
“With the continuous evolution of memory specifications and the growing complexity of the protocols, early users of new standards need access to memory models that ease adoption,” said G.J. Perdaems, Senior Director of Managed NAND Solutions at Micron. “Our team is already utilizing the Cadence UFS Memory Model successfully, and it’s encouraging to see Cadence continue its commitment to develop first-to-market solutions for the latest protocols. With the Cadence Memory Model for UFS 3.0, our engineers can confidently verify our designs with ease so they can keep their focus on designing managed memory solutions and delivering products to market faster.”
VIP for CoaXPress
The CoaXPress interface standard provides high-speed serial communication over coaxial cable. It is ideal for automated acquisition and analysis of video and images, which is becoming more important as engineers develop autonomous driving applications. It also can be used in other industrial and machine vision applications requiring transfer speeds up to 6.25Gbit/s. It utilizes Cadence TripleCheck technology, which provides a verification plan with measurable objectives linked to the specification features and a comprehensive test suite with thousands of ready-to-run tests to ensure support for the specification.
VIP for HyperRAM
HyperRAM is a high-performance 333MB/sec read performance memory based on the HyperBus interface. It is ideal for applications that focus on a small footprint, including automotive, industrial and consumer applications.
These VIP offerings join the extensive Cadence VIP library, which provides a comprehensive portfolio for automotive applications including LPDDR 4/5, Ethernet TSN , MIPI CSI-2SM, DSI-2SM and I3CSM, DisplayPort, CAN and eMMC.
These VIP offerings are part of the Cadence Verification Suite and are optimized for Xcelium™ Parallel Logic Simulation, along with supported third-party simulators. They support the company’s System Design Enablement strategy, which enables system and semiconductor companies to create complete, differentiated end products more efficiently. The Verification Suite is comprised of best-in-class core engines, verification fabric technologies and solutions that increase design quality and throughput, fulfilling verification requirements for a wide variety of applications and vertical segments.
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
- Cadence Enables Validation and Verification of PCIe 3.0 Designs with New SpeedBridge Adapter
- Cadence Accelerates Adoption of Emerging Mobile Standards With Expanded Verification IP Portfolio
- Cadence Introduces the EDA Industry's First Verification Solution for PCI Express 3.0
- PLDA Achieves IP Success with Cadence SuperSpeed USB (USB 3.0) Verification IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |