32-bit RISC-V embedded processor with TUV SUD ISO 26262 ASIL B certification
Chip Industry Maps Heterogeneous Integration
Nicky Lu talks about ‘ubiquitous intelligence’
Junko Yoshida, EETimes
5/24/2018 00:01 AM EDT
TAIPEI — In 25 years, after Facebook, Google, and Amazon have marched toward global domination by designing their own chips, what will the semiconductor industry look like? In a way, we’ve seen that future, and it’s here. Big data analysis, artificial intelligence, augmented and virtual reality, and autonomous vehicles have already emerged, although not yet in perfect form.
Nonetheless, most chip designers can’t even imagine that brave new world, let alone the inventions that they must fashion to stay relevant. A question that haunts designers is the sheer uncertainty of the industry’s direction. As Moore’s Law nears its “economic dead end” for most chip vendors (except giants like Intel and Samsung), is there somewhere else to turn?
E-mail This Article | Printer-Friendly Page |
Related News
- Sonics Introduces Next-Generation Development Environment To Ease Semiconductor IP Integration For Heterogeneous Multicore SoCs
- DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core
- NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration"
- 12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing
- Arteris Celebrates 3rd Year of Automotive ISO 26262 TCL1 Functional Safety Compliance for Magillem SoC Integration Automation
Breaking News
- Alphawave Semi announced today a refocussing of the Board of Directors after reaching the three-year milestone since the Company's IPO
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- PCI-SIG® Announces CopprLink™ Cable Specifications for PCIe® 5.0 and 6.0 Technology
Most Popular
- Silvaco Announces Launch of Initial Public Offering
- TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
- Radiation-Tolerant PolarFire® SoC FPGAs Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- QuickLogic Releases Aurora 2.6 with Expanded Operating System Support and Up to 15% Faster Performance