SMIC Announces Unaudited 2018 Interim Results
SHANGHAI -- Aug. 30, 2018 -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) one of the leading semiconductor foundries in the world, announces the unaudited interim results of operations of the Company and its subsidiaries for the six months ended June 30, 2018.
FINANCIAL HIGHLIGHTS
- Revenue was US$1,721.8 million for the six months ended June 30, 2018, an increase of 11.5% from US$1,544.3 million for the six months ended June 30, 2017. Excluding the recognition of technology licensing revenue, revenue was US$1,561.3 million for the six months ended June 30, 2018, compared to US$1,544.3 million for the six months ended June 30, 2017.
- Gross profit was US$438.0 million for the six months ended June 30, 2018, an increase of 5.6% from US$415.0 million for the six months ended June 30, 2017. Excluding the recognition of technology licensing revenue, gross profit was $277.6 million for the six months ended June 30, 2018, compared to $415.0 million for the six months ended June 30, 2017.
- Gross margin was 25.4% for the six months ended June 30, 2018, compared to 26.9% for the six months ended June 30, 2017. Excluding the recognition of technology licensing revenue, gross margin was 17.8% for the six months ended June 30, 2018, compared to 26.9% for the six months ended June 30, 2017.
- Revenue from China-region customers grew to 56.3% of total revenue excluding technology licensing for the six months ended June 30, 2018, compared to 46.0% for the six months ended June 30, 2017, representing a revenue growth of 23.9%.
- The net debt to equity ratio remained low at 9.7% as of June 30, 2018.
For the full announcement of SMIC's unaudited 2018 financial results, please click here
|
SMIC Hot IP
Related News
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |