Alan Patterson, EETimes
9/12/2018 00:01 AM EDT
TAIPEI — Chip scaling can double each year if the semiconductor industry pushes forward on a number of new technological fronts, according to TSMC Chairman Mark Liu, speaking at an industry event in Taiwan last week.
That expectation anticipates potentially faster growth for the semiconductor industry even as Moore’s Law is losing steam. Moore’s Law is the observation that transistor density in integrated circuits doubles every two years.
In the future, chipmakers will need to integrate memory and logic to create “true” 3D ICs that result in significant energy savings, said Liu at Semicon Taiwan last week. Moreover, domain-specific architectural innovations that allow software to configure hardware on the fly will also be key to achieving scaling advances.
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