Rambus and Phison Sign Patent License
Agreement includes use of Rambus memory and SerDes technologies
SUNNYVALE, Calif.-- October 10, 2018-- Rambus Inc. (NASDAQ: RMBS) today announced that Phison, a global leader in NAND Flash controller IC and storage solutions, has signed a patent license agreement. Under the terms of the agreement, Rambus will license Phison the use of a wide range of innovations in the Rambus patent portfolio, including technologies for DRAM and NAND Flash memory controllers, as well as serial links. Specific terms of the agreement are confidential.
“Rambus has been recognized as a long-time innovator in the memory and high-speed I/O space. Licensing Rambus’ patent portfolio is part of Phison’s ongoing efforts to provide its customers the best-in-class controller IC and storage solutions,” said CS Ma, director of Innovation Technology R&D Group at Phison.
“We are excited to collaborate with Phison by providing them with access to innovations that enhance their product portfolio,” said Kit Rodgers, SVP of Technology Partnerships and Corporate Development at Rambus.
For more information on Rambus solutions, visit www.rambus.com.
About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.
About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products and technologies power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |