Arm's Data Center Two Step
Smart offload chips point the way to servers
By Rick Merritt, EETimes
November 5, 2018
Arm put smart offload processors in the spotlight at its annual developers’ conference because they are stepping stones to its data center ambitions. The cloud is the latest target for the still-small designer of cores that investor Softbank is betting will be a semiconductor giant someday.
The name is a relatively new handle, but the chips have been around for years. They first emerged as TCP offload engines more than 15 years ago. Now, they sometimes ride network interface cards called smart NICs.
Along with the new smart names, the chips have taken on more jobs. Today, they handle a flexible basket of security, storage, and virtualization tasks.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Arm Ltd Hot IP
Related News
- Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips
- Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows
- NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
- Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family
- Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation