What NXP Lost and Regained Post-Qualcomm
By Junko Yoshida, EETimes
November 8, 2018
An 11-hour flight from San Francisco to Frankfurt in mid-June flipped almost every expectation in Lars Reger’s business life — lock, stock, and barrel. Anticipating the eventual merger between Qualcomm and NXP Semiconductors, Reger, NXP’s automotive CTO, had devised a technology roadmap for an automotive division that generates roughly half of NXP’s revenue.
Eleven hours earlier, Reger was resting in an airport lounge after the NXP Connects Conference in Santa Clara, awaiting his flight home. At that moment, someone approached Reger and asked him about an article in that day’s South China Morning Post. The title: “Beijing ‘approves Qualcomm’s purchase of NXP.’”
NXP and Qualcomm had been waiting 20 months for this moment. Reger broke into a big smile, high-fived his colleague, and ordered champagne.
E-mail This Article | Printer-Friendly Page |
Related News
- What does Renesas' acquisition of PCB toolmaker Altium mean?
- Five Leading Semiconductor Industry Players Incorporate New Company, Quintauris, to Drive RISC-V Ecosystem Forward
- What Is Holding Back Neuromorphic Computing?
- Unleashing Edge AI Potential: Eta Compute's New Collaboration with NXP Semiconductors
- TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process