High precision ring oscillator within +/-2% of the specified 22.1184M frequency - 0.18um EF
North American Semiconductor Equipment Industry Posts October 2018 Billings
MILPITAS, Calif. — November 20, 2018 — North America-based manufacturers of semiconductor equipment posted $2.06 billion in billings worldwide in October 2018 (three-month average basis), according to the October Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 0.9% percent lower than the final September 2018 level of $2.07 billion, and is 2.0 percent higher than the October 2017 billings level of $2.02 billion.
“October billings of North American equipment suppliers reflect near-term weakening of demand for PC, mobile phones and servers,” said Ajit Manocha, president and CEO of SEMI. "Additionally, memory manufacturers have pulled back investments in response to recent softening of memory pricing.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Billings | Year-Over-Year | |
May 2018 | $2,702.3 | 19.0% |
June 2018 | $2,484.3 | 8.0% |
July 2018 | $2,377.9 | 4.8% |
August 2018 | $2,236.8 | 2.5% |
September 2018 (final) | $2,078.6 | 1.2% |
October 2018 (prelim) | $2,059.1 | 2.0% |
Source: SEMI (www.semi.org), November 2018
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
About SEMI
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
|
Related News
- North American Semiconductor Equipment Industry Posts October 2021 Billings
- North American Semiconductor Equipment Industry Posts October 2020 Billings
- North American Semiconductor Equipment Industry Posts October 2019 Billings
- North American Semiconductor Equipment Industry Posts December 2018 Billings
- North American Semiconductor Equipment Industry Posts September 2018 Billings
Breaking News
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
Most Popular
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
E-mail This Article | Printer-Friendly Page |