GUC Announces ShenZhen Office Opening
November 28, 2018 -- Hsinchu -- Custom ASIC Leader Global Unichip Corporation (GUC) Announces Official Opening of ShenZhen Office. GUC requires new space to enhance both technical and business support to South China customers. The GUC office is located at No. 1305 Building 9A ShenZhen Bay Echo Hi-tech Park, Shahe Western Road, Nanshan District, ShenZhen City
The new office space provides customer with efficient, timely and optimally localized ASIC services. It also shows GUC's strategic initiative to work more closely with our local customers.
"GUC substantiates our strong commitment to provide the best ASIC services to the China market," explained Dr. Ken Chen, President of GUC. "These new facilities also highlight our capability to grow with key China customers as they expanded their global influence."
GUC China Region General Manager, Dr. Simon Yen, said“GUC's significant and tactic expansion in ShenZhen Office represents our strong commitment to provide the best ASIC services to South China market. We look forward to growing together with our China customers to create a mutually-beneficial win-win situation."
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Custom ASIC Leader, who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.
|
Related News
- GUC Announces Nanjing Office Opening
- Global Unichip Announces Opening of the GUC Shanghai Office in China
- GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations
- GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
- Veriest announces opening of Budapest office
Breaking News
- TSMC September 2024 Revenue Report
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Intel, TSMC to detail 2nm processes at IEDM
- SensiML Expands Platform Support to Include the RISC-V Architecture
- MIPI Alliance Announces OEM, Expanded Ecosystem Support for MIPI A-PHY Automotive SerDes Specification
Most Popular
- Deeptech Keysom completes a €4M fundraising and deploys the first “no-code” tool dedicated to the design of tailor-made processors
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |