English
NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process
January 7, 2019 -- Innosilicon proudly announced silicon successful of world first silicon proven commercial GDDR6 IP on Samsung's 14LPP Process. It is fully compliant to the JEDEC GDDR6 (JESD250) standard, supporting up to 16 Gbps per pin. GDDR6 memory is targeted at very high-bandwidth applications including machine learning, AI, cryptocurrency mining, graphics, Data Centre, automated driving, ADAS and high-performance computing (HPC). Samsung is enabling this advanced IP on the 14LPP foundry process for customers to design next-generation chips in the hottest application areas, for use with high-performance GDDR6 memory products. For more information, please visit http://www.innosilicon.com/html/ip-solution/14.html.
|
||||||
Related News
- Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- OPENEDGES and The Six Semi Announce Silicon Proven LPDDR5/4/4x PHY in Samsung Foundry 14LPP Technology Operating at 6400Mbps
- OPENEDGES and The Six Semi Announce Silicon Proven GDDR6 PHY in 12nm Process Technology
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |