Updated HBM Standard Geared for HPC, Networking
By Gary Hilson
EETimes, January 18, 2019
TORONTO — High Bandwidth Memory (HBM), like many other memory technologies, is being adopted for emerging use cases that didn’t exist at its inception because of specific characteristics such performance, capacity and power consumption. But it won’t be long before there’s pressure to improve upon them as adoption in newer scenarios takes off.
The Jedec Solid State Technology Association’s most recent update to the JESD235 HBM DRAM standard focuses on meeting the needs of applications in which peak bandwidth, bandwidth per watt, and capacity per area are critical metrics. Such applications include high-performance graphics, network and client applications, and high-performance computing.
E-mail This Article | Printer-Friendly Page |
Related News
- Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
- GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs
- JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
- GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
- Faraday Geared Up for Data Communication Applications in ASIC Development
Breaking News
- Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal