Rambus Reports Fourth Quarter and Fiscal Year 2018 Financial Results
SUNNYVALE, Calif. – January 28, 2019 – Rambus Inc. (NASDAQ:RMBS) today reported financial results for the fourth quarter ended December 31, 2018 under GAAP Accounting Standards Codification Topic 606 (“ASC 606”), which superseded the revenue recognition requirements in ASC Topic 605, Revenue Recognition (“ASC 605”) that was previously applicable. Rambus also reported financial results as they would have been presented under ASC 605. This ASC 605 presentation is required under the modified retrospective transition method that Rambus has chosen to adopt under ASC 606. Rambus notes that this presentation allows a more relevant comparability with prior results, which were all reported under ASC 605.
Luc Seraphin, chief executive officer of Rambus said, “Rambus had a strong fourth quarter and solid year overall, with continued execution from our product teams and record annual revenue for IP cores and server DIMM chips. As we refocus our product portfolio around our core strengths in semiconductor, improve operational efficiency, and continue to generate cash from operations, we align the company for profitable growth.”
Highlights
- Fourth quarter GAAP revenue of $68.5 million; revenue under ASC 605 would have been $102.0 million, in line with expectations; $35.1 million in cash provided by operating activities
- Record product revenue in 2018 for IP cores and server DIMM chips with wins at Tier 1 customers in data center and communications segments worldwide
- CryptoManager platform selected to securely provision Authenta™ secure memory product line at Micron
E-mail This Article | Printer-Friendly Page |
|
Related News
- Rambus Reports Fourth Quarter and Fiscal Year 2023 Financial Results
- Rambus Reports Fourth Quarter and Fiscal Year 2022 Financial Results
- Rambus Reports Fourth Quarter and Fiscal Year 2021 Financial Results
- Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results
- Rambus Reports Fourth Quarter and Fiscal Year 2019 Financial Results
Breaking News
- After TSMC fab in Japan, advanced packaging facility is next
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- SoC Secure Boot Hardware Engine IP Core Now Available from CAST
- QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
Most Popular
- Former Moortec executives create chip monitor startup
- PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering
- Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
- Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
- Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles