Mountain View, California - 2002/12/23 - Sonics, Inc. today announced that Taiwan Semiconductor Manufacturing Company (TSMC) has officially endorsed Sonics' SMART approach as a preferred method for rapid development of complex System on Chip (SOC) devices. With a growing number of Sonics enabled devices in high volume production at TSMC, the methodology and architecture supplied by Sonics is truly "production proven".
"The combination of Sonics' unique SMART Interconnect IP and their methodology for SOC creation has enabled our customers to take the best advantage of TSMC's world leading semiconductor capability in the shortest possible time," said Ed Chen, Director of Design and eService Marketing at TSMC. "Having proven their technology in these production designs has enabled them to become a preferred supplier for interconnect IP."
"Sonics continues to work closely with TSMC as our preferred semiconductor technology supplier," said Grant Pierce, President and CEO of Sonics. "TSMC continues to be the benchmark with which we characterize all of our IP products. We look forward to enhancing our cooperative efforts in the use of IP throughout the TSMC-centered supply chain."
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates one advanced 300mm wafer fab, six eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC) and at its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90 nanometer technology alignment program with its customers. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. For more information about TSMC to http://www.tsmc.com.
About Sonics, Inc.
Sonics, Inc. is a premier developer of intelligent semiconductor intellectual property (IP) solutions that dramatically accelerate complex system-on-chip (SOC) designs while minimizing risk. The Sonics Methodology and Architecture for Rapid Time-to market (SMART ) initiative is a comprehensive collection of products, services and partnerships to ensure customer success when utilizing Sonics SMART interconnect IP. SMART users can develop devices with higher functionality, lower power consumption and lower cost while achieving greater SOC complexity faster. Major semiconductor and systems companies have embraced Sonics SMART products for SOC applications in the communications, networking and multimedia markets, often reporting better than six-month design time savings with reduced design and manufacturing risks. For more information, see www.sonicsinc.com.