Data Centers Open Source Silicon
Liquid cooling bubbles up at Open Compute Summit
By Rick Merritt, EETimes
March 15, 2019
SAN JOSE, Calif. — Microsoft and partners released open source RTL for a new data compression scheme, and Intel said another effort may do the same for a security block. The moves mark the first steps into open source silicon from data center giants in the Open Compute Project (OCP).
The projects were indicators of the depth and breadth of work to drive the world’s largest data centers forward. It comes at a time when Moore’s law is slowing and workloads such as deep learning are growing, forcing engineers to pull out all the stops in their quest for performance.
For example, vendors showed a half dozen alternative approaches to cooling fast chips, including immersion baths. With dozens of hot processors and accelerators in the pipeline, one executive said he hopes an OCP committee can draft standards by next year for the area.
More than 3,500 engineers registered for the annual OCP event. The group has 178 members said to spend $2.56 billion a year on data center gear, forecast to rise to nearly $11 billion by 2022
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers
- Innovium Adopts the Cadence Innovus Implementation System for Its Highly Scalable Switch Silicon Family for Data Centers
- Renode 1.4 released: 64-bit RISC-V HiFive Unleashed support, multiple Silicon Labs targets, and more
- INSIDE Secure and Marvell Deliver Open Source Open Data Plane Security VPN Solution
- Technology Leaders Join Forces to Bring an Open Acceleration Framework to Data Centers and Other Markets
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation