3x3mm MCU
![]() |
3x3mm MCU
By David Larner, Embedded Systems
September 6, 2001 (9:26 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010906S0055
Cygnal Integrated Products announced the C8051F300, microcontroller in a tiny 3x3mm footprint. Compute capability is supplied by a pipelined 8051 CPU, delivering up to 25MIPS at 25MHz. An 8-bit 500ksps A/D Converter with integrated temperature sensor is included for data acquisition. A low power programmable analogue comparator is suitable for monitoring system voltages or as a wake-up source. Programmable counters and timers can be configured for a wide range of uses, including pulse-width modulators and a real-time clock. A 2% accurate on-chip oscillator allows the built-in UART to function without an external crystal. Also on board is 8kBytes of in-system programmable FLASH. Integrated on-chip debug circuitry eliminates the need for large profile sockets and expensive in-circuit emulators. Both development kits and chips will be available in October.
Related News
- Will RISC-V reduce auto MCU's future risk?
- Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |