3x3mm MCU
3x3mm MCU
By David Larner, Embedded Systems
September 6, 2001 (9:26 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010906S0055
Cygnal Integrated Products announced the C8051F300, microcontroller in a tiny 3x3mm footprint. Compute capability is supplied by a pipelined 8051 CPU, delivering up to 25MIPS at 25MHz. An 8-bit 500ksps A/D Converter with integrated temperature sensor is included for data acquisition. A low power programmable analogue comparator is suitable for monitoring system voltages or as a wake-up source. Programmable counters and timers can be configured for a wide range of uses, including pulse-width modulators and a real-time clock. A 2% accurate on-chip oscillator allows the built-in UART to function without an external crystal. Also on board is 8kBytes of in-system programmable FLASH. Integrated on-chip debug circuitry eliminates the need for large profile sockets and expensive in-circuit emulators. Both development kits and chips will be available in October.
Related News
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- VeriSilicon's industry-leading embedded GPU IP powers HPMicro's high-performance HPM6800 series RISC-V MCU
- Renesas Unveils Processor Roadmap for Next-Gen Automotive SoCs and MCUs
- Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
Breaking News
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |