Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology
Cadence IP is complete and ready for use by customers creating SoCs for ADAS and L3/L4 autonomous driving applications
SAN JOSE, Calif., 17 Apr 2019 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® LPDDR4/4X memory IP subsystem, utilizing TSMC’s 16nm FinFET Compact (16FFC) technology, has achieved ISO 26262 ASIL C certification from SGS-TÜV Saar. The certification confirms that the Cadence IP is complete and ready for use by customers creating advanced systems-on-chip (SoCs) for advanced driver assistance systems (ADAS) and L3/L4 autonomous driving applications.
“High-performance memory subsystems are essential elements in ADAS and autonomous driving applications and must be developed to meet more stringent requirements,” stated Wolfgang Ruf, product manager, Semiconductors, at SGS-TÜV Saar. “Following a rigorous evaluation, the Cadence LPDDR4/4X PHY and controller subsystem has been certified by SGS-TÜV Saar in accordance with the ISO 26262 standard and is ASIL C ready, allowing SoC designers to use this high-performance subsystem as a critical design element in ASIL C systems.”
Both established and new entrants into the automotive market—start-ups, OEMs and internet companies—have to cope with meeting stringent functional safety requirements. To ease the delivery of safety-critical applications, design teams need access to proven, ISO 26262 ASIL C-ready IP such as the Cadence LPDDR4/4X memory subsystem, which includes the leading-edge Cadence 4266 speed grade LPDDR4/4X DDR PHY, controller IP, and Cadence VIP. For more information on the LPDDR4/4X memory IP subsystem, please visit www.cadence.com/go/lpddr4ipac.
“We’re pleased with the results of our ongoing collaboration with Cadence in developing a robust, comprehensive set of IP that enables today’s complex automotive designs for ADAS and autonomous driving applications,” said Suk Lee, TSMC senior director, Design Infrastructure Management Division at TSMC. “The automotive-grade LPDDR4/4X design IP from Cadence is silicon-proven on TSMC’s 16nm FinFET technology, an industry-leading process for advanced automotive applications, including ADAS and autonomous driving chips where ISO 26262 ASIL C readiness is a critical requirement for processor and memory subsystem functionality.”
“The most critical aspect of advanced SoCs for ADAS, autonomous driving and other automotive systems is the processor and memory subsystem, which has stringent functional safety requirements,” said Amjad Qureshi, corporate vice president of R&D, Design IP Group, at Cadence. “We’ve collaborated closely with our automotive customers, SGS-TÜV Saar and TSMC to complete the functional safety analysis and auditing process to achieve ISO 26262 ASIL C-ready certification, and customers can now confidently use our high-performance LPDDR PHYs and controllers in their automotive designs.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Andes Technology Is the First RISC-V Vendor to Accomplish ISO 26262 Functional Safety ASIL D Development Process Certification with SGS-TÜV Saar
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
- Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar
- Arasan achieves ISO 26262 ASIL B automotive safety certification for its Total eMMC IP Solution
- Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |