ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment

May 1, 2019 -- Intel today announced that ZTE*, a multinational telecommunications equipment and systems company, selected Intel® eASIC™ devices for its 5G wireless products*. ZTE selected Intel eASIC devices to meet the critical cost and power requirements demanded by large-scale 5G deployments.

“Intel’s alliance with ZTE marks a major milestone in Intel eASIC device’s 5G penetration. 5G speeds will enable new classes of applications, resulting in an exponential increase in data volume. Our customers need solutions that allow them to design optimal systems they can take to market quickly. Intel’s structured and standard ASICs enable ZTE to achieve critical cost goals and cement their position in the exploding 5G market.”
- Dan McNamara, Intel senior vice president and general manager of the Programmable Solutions Group

Why It’s Important: As 5G rollout moves from the trial phase to initial deployment, carriers need flexible solutions based on field programmable gate arrays (FPGAs). FPGAs provide hardware programmability to meet both prototyping and initial production requirements. As the 5G rollout then transitions to high volume production the FPGAs transition to ASICs to meet cost and power targets associated with high-volume shipments. Intel’s recent acquisition of eASIC enables a smooth transition from FPGA-based designs to structured ASICs.

ZTE used FPGAs for rapid prototyping and early production. The company needed to quickly transition to a lower unit cost and reduced power solution for high-volume deployment.

“Intel eASIC devices provide good power and cost benefits our 5G wireless products and were essential to make a fast transition to meet our low cost and power requirements,” said Duan Xiang Yang, VP and General Manager of Wireless System Architect at ZTE.

What It Does: A structured ASIC is an intermediary technology between FPGAs and standard-cell ASICs that provides unit-cost reduction and improved power efficiency. Structured ASICs offer benefits like those offered by standard-cell ASICs, but with faster development time. Intel eASIC devices are structured ASICs that provide a smooth design transition from any FPGA. They reduce unit cost and power consumption as compared to FPGAs. These two benefits are especially important for high volume-markets, such as 5G radio.

What It Delivers: ZTE was able to meet time-to-market requirements using FPGAs for its 5G design. The smooth transition to an eASIC structured ASIC device reduces the design’s bill of materials (BOM) cost and power consumption, which is required for high-volume production. The combination of FPGAs and Intel eASIC structured ASICs allows customers to meet diverse time-to-market, flexibility, performance, low-power, and unit-cost requirements.

What the Future Holds: The combination of Intel FPGAs, Intel eASIC devices, and Embedded Multi-Die Interconnect Bridge (EMIB) technology will enable a new device class with flexibility, lower unit cost and power efficiency, all in a single package.

More Context: To learn more about Intel eASIC devices, visit Web Link.

The Small Print: The precise features and benefits provided by Intel eASIC devices depend on specific design implementations. Power and cost benefits vary depending on the customer design configuration, size and implementation. Check with your system manufacturer or retailer or learn more at intel.com.