Arteris IP FlexNoC & Resilience Package Licensed by Semidrive for ISO 26262-Compliant Autonomous Driving Chips
Network-on-Chip technology enables functional safety and performance for highly complex automotive systems-on-chip (SoCs)
CAMPBELL, Calif. – May 7, 2019– Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Semidrive has licensed the Arteris IP FlexNoC Interconnect and the accompanying FlexNoC Resilience Package for use in chips that are the brains in automotive autonomous driving and advanced driver assistance systems (ADAS).
Related |
FlexNoC 5 Network-on-Chip (NoC) FlexNoC Functional Safety (FuSa) Option helps meet up to ISO 26262 ASIL B and D requirements against random hardware faults. |
Semidrive is a privately funded semiconductor company focusing on automotive ADAS and autonomous driving applications based in Nanjing, China, with research and development teams in Nanjing and Shanghai.
“Arteris IP offers us technology and expertise in both network-on-chip interconnects and functional safety,” said Maggie Qiu, CEO at Semidrive. “The combination of FlexNoC and the Resilience Package enables us to develop chips that not only meet our demanding requirements for performance, power consumption and die area, but also incorporate on-chip functional safety mechanisms that help us achieve ISO 26262 certification for automotive functional safety.”
“We are excited that Semidrive has chosen Arteris IP FlexNoC with the Resilience Package as the on-chip communications backbone of a new generation of autonomous driving and ADAS chips,” said K. Charles Janac, President and CEO of Arteris IP. “Semidrive’s choice of Arteris IP is proof of our company’s expertise in enabling highly complex ISO 26262-compliant systems-on-chip.”
About Semidrive
Semidrive is a privately funded semiconductor company focusing on automotive applications including ADAS and autonomous driving. Semidrive is based in Nanjing, with a R&D team both in Nanjing and Shanghai. It is dedicated to work with our customers and partners to make cars smarter, safer and connected.
About Arteris IP
Arteris IP provides network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Baidu, Mobileye, Samsung, Huawei / HiSilicon, Toshiba and NXP. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com
|
Arteris Hot IP
Related News
- Arteris IP FlexNoC & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
- Arteris IP FlexNoC Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems
- Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips
- Arteris IP FlexNoC Interconnect and Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems
Breaking News
- Ceva, Inc. Announces Third Quarter 2024 Financial Results
- Logic Fruit Technologies Launches JESD204D Transmitter and Receiver IP - Advancing High-Bandwidth Data Solutions
- Sondrel announces that it is opening up its library of IP for licensing
- Tessolve to Acquire Germany's Dream Chip Technologies
- Arteris Announces Financial Results for the Third Quarter 2024 and Fourth Quarter and Full Year 2024 Guidance
Most Popular
- 珠海创飞芯:基于28 纳米高压工艺制程的OTP IP 实现上架
- Jolt Capital buys and invests in Dolphin Design's carved-out mixed-signal IP activities
- Arteris Announces Financial Results for the Third Quarter 2024 and Fourth Quarter and Full Year 2024 Guidance
- Tessolve to Acquire Germany's Dream Chip Technologies
- M31 Launches USB4 IP for TSMC 5nm Process
E-mail This Article | Printer-Friendly Page |