MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Intel Targets 2021 for 7 nm
By Dylan McGrath, EETimes
May 9, 2019
SAN FRANCISCO — After a long delay, Intel will start shipping its first 10-nm processors in June, consistent with the schedule the company has been communicating since last year, executives said.
Intel also plans to begin shipping 7-nm processors in 2021, executives told analysts at the company’s annual investor day. The 7-nm process technology will mark Intel’s first use of extreme ultraviolet (EUV) lithography.
Murthy Renduchintala, Intel’s chief engineering officer and president of the company’s Technology, Systems Architecture and Client Group, reiterated that Intel’s first 10-nm processors to ship will be its Ice Lake notebook PC processors. Renduchintala added that Intel plans to launch several 10-nm products in 2019 and 2020.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
- Vidatronic Expands FinFET Portfolio with 7 nm to 4 nm FlexGUARD™ and Power Quencher® Intellectual Properties (IPs) Available for Licensing
- Analog Bits to Present Papers, Demo of N5 Working Silicon, and Roadmap on IPs for TSMC N4 and N3 Processes
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024