June 3, 2019 -- Omni Design Technologies, Inc. will be presenting its latest groundbreaking ultra-low power embedded IP cores at the 2019 Design Automation Conference (DAC), to be held in Las Vegas in booth # 549. The exhibition floor will be open from 10am to 6pm from Monday, June 3rd through Wednesday, June 5th.
Omni Design will be demonstrating its Hyperon 28nm Analog-to-Digital Converter, sampling at 1.2Gsps with 14 bits of resolution. This converter is ideal for high performance wireless and wireline communication applications. Dr. Hyun Boo will be conducting a video demonstration with Omni Design’s automated test set-up. Mr. Sid Dutta, Vice President, Dr. Vaibhav Tripathi, Director, and Dr. Kush Gulati, Omni Design's CEO, will also be available to discuss the performance advantages of Omni’s new 12-bit Analog-to-Digital Converters (ADCs) and Digital to-Analog Converters (DACs) built in the FinFET 16nm process, as well as new products under development in FinFET 7nm.
Omni Design’s world-class IP products include extremely precise voltage/temperature sensors, process monitors, ultra-low power band-gaps, oscillators, voltage regulators, and sensor interfaces targeted to extreme low power IoT systems.
Please stop by our booth to meet with the Omni team and learn more about our company.
About Omni Design Technologies:
Omni Design Technologies (http://www.omnidesigntech.com/) designs and develops the world's highest-performance ultra-low power embedded IP cores by leveraging our revolutionary and proprietary SWIFT™ circuit technology. Omni’s mission is to provide a wide range of disruptive ultra-low-power, high-performance embedded circuits that enable advanced systems applications, including 5G wireless communications, automotive ethernet, and automotive LIDAR. Omni is staffed by semiconductor industry veterans, world class technologists from MIT, and experienced entrepreneurs.