June 17, 2019 -- Moortec will be showcasing its range of PVT Monitoring Subsystem Solutions supporting advanced node processes at the TSMC 2019 China Technology Symposium, taking place on Tuesday 18th of June at the Shanghai International Convention Centre (SICC). Visit us at the event to discuss how your next SoC project could benefit from our highly accurate, highly featured in-chip monitors which provide solutions for thermal management, detection of supply anomalies and the identification of process corners.
Visit booth #36 to learn more about Moortec’s range of silicon proven, ‘off the shelf’ monitoring IP solutions. Moortec monitoring IP is used by a wide range of customers worldwide for monitoring and controlling conditions on-chip to optimise performance, save power, increase reliability and cut costs.
Moortec provide market leading high accuracy, highly featured PVT Subsystem IP for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. The Moortec Subsystem provides ASIC designers solutions for thermal management, detection of supply anomalies and the identification of process corners.
Of particular relevance at the event will be the continued focus on applications such as AI, Data Centre, Automotive, SSD Controllers and IoT. As a company Moortec are committed to expanding its advanced node in-chip monitoring portfolio while maintaining our focus as the leading PVT provider.
To arrange a meeting at this event please email ramsay.allen@moortec.com or visit www.moortec.com
About Moortec
Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimization, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the Automotive, AI, IoT, Datacenter, DTV, HPC and Networking sectors.
For more information please visit www.moortec.com