Lattice Semiconductor Delivers Flexible Connectivity for Industrial Vision Applications with New CrossLink Reference Design
New SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design helps machine vision and robotics applications leverage advanced application processors
HILLSBORO, OR – July 16, 2019 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the availability of the latest in a series of new reference designs featuring the Lattice CrossLink™ FPGA for video bridging applications. The SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design provides industrial device customers with a flexible, easy-to-implement solution for connecting advanced application processors (APs) with many of the image sensors currently used in today’s machine vision applications for industrial environments.
Many industrial machine vision applications use image sensors with SubLVDS interface, which is incompatible with the MIPI CSI-2 D-PHY interface used on today’s APs. However, many industrial device OEMs want to implement these APs in existing machine vision-capable products. The Lattice SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design lets customers quickly and easily create a bridging solution so an AP with a MIPI CSI-2 interface can connect with a SubLVDS image sensor.
“In industrial environments, customers are interested in upgrading legacy machine vision applications to take advantage of the processing capabilities and feature sets of new APs,” said Peiju Chiang, Product Marketing Manager, Lattice Semiconductor. “Rather than devote precious time and engineering resources on an extensive device redesign, the Lattice CrossLink SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design provides a simple workaround that addresses legacy interface compatibility issues to get redesigned products to market quickly and cost effectively.”
The Lattice SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design is free and is provided to demonstrate the use of Lattice’s popular CrossLink modular IPs, including the Pixel-to-Byte Converter, SubLVDS Image Sensor Receiver and a CSI-2/DSI D-PHY Transmitter. Lattice also provides a complete, easy to use GUI-based FPGA design and verification software environment, Diamond® design software, to simplify and accelerate device development.
Other key features include:
- 4, 6, 8, or 10 lane SubLVDS input to 1, 2, or 4 lane MIPI CSI-2 output
- Up to 1.2 Gbps bandwidth per input lane
- Up to 1.5 Gbps bandwidth per output lane
- Dynamic parameter setting via I2C
- Optional support for image cropping
More information about the new CrossLink SubLVDS to MIPI CSI-2 Image Sensor Bridge reference design is available here.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
For more information about Lattice, please visit www.latticesemi.com.
|
Related News
- Lattice Semiconductor will Showcase New Reference Design for MIPI CSI-2 Image Sensor Bridge at CES 2013
- Lattice Semiconductor, Fairchild Imaging and Helion Vision to Demonstrate new FPGA-Based Image Sensor Solution at VISION 2014
- Latest Release of Lattice sensAI Solutions Stack Delivers up to 6X Performance Boost on Award-Winning CrossLink-NX FPGAs
- Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems
- Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications
Breaking News
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
- BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
- Rambus and AMD Extend Patent License Agreement
Most Popular
- TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
- CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
- North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
- Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
- SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |