EnglishMIPI D-PHY 2.0Gbps (4-lanes TX/RX, PLL integrated) TSMC 16FF+LL
300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
MILPITAS, Calif. — September 3, 2019 — 300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to the SEMI Industry Research and Statistics group in its first edition of the 300mm Fab Outlook report.
Most of the surges in fab equipment investment over the five-year outlook will be driven by memory (primarily NAND), foundry/logic, and power. Korea will head the list of top-spending regions followed by Taiwan and China, though Europe/Mideast and Southeast Asia are also expected to show healthy increases between 2019 and 2023.
Offering projections through 2023, the 300mm Fab Outlook report details fab investments across construction and equipment, as well as fab capacities and technologies investment for DRAM, NAND, foundry, logic, and a host of other products manufactured on 300mm wafers.
Fab equipment spending and volume fabs/lines count 2012-2023 and high-probability fab projects
The number of semiconductor fabs/lines in operation is expected to jump more than 30 percent, from 136 in 2019 to 172 in 2023, and climb even higher, to nearly 200, when lower probability fabs/lines are included in the count.
The new SEMI 300mm Fab Outlook report shows facility details by quarter through 2023 and also includes projections for fab projects through 2030 with estimates of various probabilities.
To learn more about the SEMI 300mm Fab Outlook report, click here.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more
|
||||||
Related News
- Global Fab Equipment Spending to Rebound in 2020 with 20 Percent Growth
- Global Fab Spending to See 2019 Decline, New Highs in 2020
- Total Fab Equipment Spending Reverses Course, Growth Outlook Revised Downward
- Worldwide Semiconductor Equipment Billings Reach $16.7 Billion in Second Quarter 2018, SEMI Reports
- Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion, SEMI Reports
Breaking News
- Graphcore leveraged Mentor's Questa technologies to verify massive Colossus GC2 AI processor
- UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions
- High-speed comms options enable in-life debug and optimization for datacenter, HPC and storage customers
- Expanding Universe for HPC, NVIDIA CEO Brings GPU Acceleration to Arm
- IntelliProp to Demo World's First UPI to Gen-Z Load/Store Host Adapter at SC19
Most Popular
- Synopsys Completes Acquisition of DINI Group
- Intel to Reclaim Number One Semiconductor Supplier Ranking in 2019
- Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators
- NUVIA Raises $53 Million to Reimagine Silicon Design for the Data Center
- ArchiTek Select SiFive and DTS-Insight To Enable Next-Generation AI Solution Development
|
E-mail This Article | 
|
|
Printer-Friendly Page |