Plymouth, UK, 16th September 2019 -- Moortec, specialists in Embedded In-Chip Monitoring Subsystem IP are pleased to announce that they have appointed Lee Vick as their new Vice President of North America Sales.
Lee will be promoting Moortec’s innovative embedded subsystem PVT IP on 40nm, 28nm, 16nm, 12nm, 7nm and below across the territory, building on the existing successes in AI, ML and data centre applications.
“Moortec are clearly focused on expanding their already established business in North America, and I’m excited to be joining the industry’s leading supplier of PVT monitoring IP at a time when it moves from an insurance policy to really delivering demonstrable benefits in device reliability and performance at advanced nodes.”, said Lee Vick, the new VP of NA Sales at Moortec.
Lee has a wealth of experience within the semiconductor industry across sales, business development, and engineering roles. During his 15 years at Tensilica (acquired by Cadence in 2013) he worked most recently as Global IP Sales Manager where he managed all processor IP activity at Intel, and previously as Director of Strategic Planning and Director of WW Field Applications Engineering among other roles. He has also served at Intel as a strategic planner responsible for long -term roadmaps for all PC CPUs and chipsets, and in engineering and architecture roles at Compaq, TI, and the Dept. of Defense. Lee has a BSEE from the University of Texas.
“We are delighted to have Lee onboard representing Moortec in North America and particularly the Bay Area as we continue to enhance our position as the Global Leaders of Advanced Node Embedded In-Chip Monitoring design,” said Tim Penhale-Jones, EVP of Sales at Moortec.
About Moortec Semiconductor
Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimization, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors.
To arrange a face to face meeting with Lee, email email@example.com. For more information visit www.moortec.com or call +44 1752 875130.