Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara
Plymouth, UK, 25th September, 2019 -- Moortec, the go-to leaders of in-chip technologies will be showcasing their PVT Monitoring Subsystem IP at the 2019 TSMC Open Innovation Platform® Ecosystem Forum at Santa Clara Convention Centre on Thursday, 26th September, 2019.
Of particular relevance at this year’s event will be the addition of N5 & N5P to Moortec’s PVT Monitoring Subsystem portfolio. With applications such as Artificial Intelligence (AI), Machine Learning (ML), Data Center High Performance Computing and 5G driving the demand in 5nm, we’re already working with leading customers to provide an N5/N5P solution early.
Moortec’s CEO, Stephen Crosher will also be presenting a paper entitled “The Challenges Posed by Dynamic Uncertainty on AI & ML Devices Targeting 16nm, 7nm & 5nm” during the OIP Forum multi-track technical sessions.
Visit booth #703 to discuss your embedded monitoring requirements with our expert team who can explain why this type of IP has become such a mandatory part of advanced node system design.
Moortec are proud to be full and active members of the TSMC IP Alliance program, a key component of TSMC Open Innovation Platform® (OIP). Being a TSMC IP Alliance member, Moortec can leverage TSMC's advanced technologies with its high-performance analog IP and subsystem solutions. Moortec’s portfolio of PVT sensing fabric IPs has been validated on TSMC’s major processes ranging from 40nm to 7nm.
About Moortec
Moortec have been providing innovative embedded subsystem PVT IP solutions for over a decade, empowering their customers with the most advanced monitoring IP on 40nm, 28nm, 16nm, 12nm, 7nm and 5nm. Moortec’s in-chip sensing products support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, helping to bring product success by differentiating the customers’ technology. With a world-class design team, excellent support and a rapidly expanding global customer base, Moortec are the go-to leaders in innovative in-chip technologies for the automotive, consumer, high performance computing, mobile and telecommunications market sectors.
For more information please contact mailto:press@moortec.com, +44 1752 875133, visit www.moortec.com
|
Related News
- Moortec To Showcase Its Latest Embedded PVT Monitoring IP For 40nm-5nm At The 2019 ICCAD in Nanjing
- Moortec to Showcase its Latest Embedded PVT Monitoring IP for 40nm-5nm at the 2019 ARM TechCon in San Jose
- Silicon Creations to Showcase PLL Developments on 22nm to 5nm Processes at TSMC 2019 Open Innovation Platform Ecosystem Forum
- Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
- Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |