Xilinx Issues Statement in Response to Analog Devices Patent Infringement Lawsuit
SAN JOSE, Calif., Dec. 5, 2019 -- Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today issued a response to the patent infringement lawsuit filed today by Analog Devices, Inc.
The statement is the following:
On December 5, 2019, a patent infringement lawsuit was filed by Analog Devices against Xilinx and our Zynq UltraScale+ RFSoC in the United States District Court for the District of Delaware. We intend to vigorously defend against this lawsuit. Xilinx has a history of creating pioneering technology spanning multiple decades. We created what many thought could not be done with the introduction of the Zynq UltraScale+ RFSoC - the industry's only single-chip adaptable radio platform. Through its patent lawsuit, Analog Devices has chosen to litigate rather than compete in the market.
About Xilinx
Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies – from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs, and the ACAP, designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent, and connected world of the future. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Files Patent Infringement Lawsuit Against Analog Devices
- UMC Issues Statement in Response to Recent Indictment and Civil Complaint
- UMC Files Patent Infringement Lawsuit against Micron
- Judge Orders Kilopass to Pay Sidense $5.5 Million in Legal Fees and Costs for Baseless Patent Infringement Lawsuit
- Xilinx and Analog Devices Achieve JEDEC JESD204B Interoperability
Breaking News
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- Quobly announces key milestone for fault-tolerant quantum computing
- CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
Most Popular
- SiFive Empowers AI at Scale with RISC-V Innovation
- MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles
- Alphawave IP - Announcement regarding leadership transition
- Now Gelsinger is gone, what is Intel's Plan B?
- Sondrel now shipping chips as part of a complete turnkey project
E-mail This Article | Printer-Friendly Page |