Flexible IP building blocks enable dual mode 3G handsets for next generation networks
22 January 2003 - TTPCom Ltd. (LSE: TTC), the world's leading independent supplier of technology for digital wireless communications, today announces its complete 3G technology set enabling silicon vendors and handset manufacturers to develop stand alone 3G or dual mode 3G/GSM devices for launch in 2004.
For silicon vendors TTPCom offers 3G intellectual property (IP) in the form of baseband and radio chip designs. In this area TTPCom has developed a range of flexible IP building blocks that enable silicon vendors to complement their existing in-house technology in the development of dual mode products. The company has already engaged with two silicon companies to utilise this portable IP approach for the development of dual mode 3G/GSM baseband chips and is now in the process of validating the system solution for use by handset manufacturers.
"TTPCom's flexible approach enables our semiconductor partners to capitalise on the investments they have already made in developing wireless technology and to realise integrated dual mode technology. If that means our partners already have GSM technology then TTPCom can provide the 3G upgrades; if they already have 3G then we can provide GSM technology; and for those starting from scratch, we can provide a fully integrated dual mode 3G/GSM solution" stated Chris Tunsley, 3G Programme Manager at TTPCom. "We aim to bring maximum flexibility to our customers and thereby offer them the fastest possible route to market for single mode 3G, single mode GSM or dual mode 3G/GSM products".
For handset manufacturers TTPCom offers 3G/GSM dual mode protocol software that is warranted to work with silicon from any of its semiconductor partners. Terminal manufacturers licensing TTPCom's protocol software now, and working with TTPCom's silicon partners, will be well placed to offer dual mode handsets to market in 2004. In addition TTPCom provides a flexible applications framework that enables manufacturers to quickly customise their handsets with new services and applications, such as video streaming and 3D downloadable games, all designed to take advantage of the higher bandwidth available on 3G networks.
"After over three years of development effort TTPCom is now uniquely positioned to support developers of 3G terminals irrespective of their current level of technology. We have ‘all the bases covered' because for silicon companies we offer dual mode IP for the development of radio and baseband chips; for terminal manufacturers we offer 3G protocol and application software that is compatible with our silicon partners' chips, and for those new to the market we offer complete 3G handset design services," stated Richard Fry, Sales and Marketing Director at TTPCom. "Our systems view, ‘from applications to antenna', gives us a unique insight into the interrelationships of all this technology and enables us to offer fully integrated systems solutions that can meet the price and performance expectations that end users already enjoy with 2.5G terminals".
TTPCom's radio RFIC technology is at an advanced stage, with first silicon from its partner, Matsushita Electric Industrial (MEI) having successfully completed functional tests. Full details of this and the capabilities of TTPCom's new Ajar applications platform are provided in separate releases issued today.