Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand
SAN JOSE, Calif. -- Feb 13, 2020 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) announced that it has acquired Integrand Software, Inc. to further accelerate innovation in the 5G RF communications space. Integrand’s EMX® technology has the industry-leading Method of Moments (MoM) solver technology for analysis and extraction and enables designers to accurately and efficiently simulate large integrated circuits (ICs) and advanced packages, characterize passive components and analyze interconnect parasitics in 3D-IC systems.
Executing upon the Cadence® Intelligent System Design™ strategy, the integration of Integrand EMX with the Cadence Virtuoso®, Sigrity™, Clarity™ and AWR® solutions offers customers a complete electromagnetic signoff solution.
The terms of the transaction were not disclosed.
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to Intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
- Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
- Cadence to Acquire AWR Corporation from National Instruments to Accelerate System Innovation for 5G RF Communications
- Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation
- Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation
- Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |