3DSP lines up software development support from India's Wipro
![]() |
3DSP lines up software development support from India's Wipro
By Semiconductor Business News
September 3, 2001 (9:53 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010830S0098
BANGALORE, India --Wipro Technologies here today announced it has joined a partnership program at U.S.-based 3DSP Corp. to develop MPEG-4 video software for digital signal processing (DSP) ICs. The two companies said they are also planning an ongoing alliance for wireless and video applications, based on 3DSP's platform. The partnership with Wipro will enable 3DSP customers to use expertise in multimedia and networking software development for system-on-chip designs, said Tom Beaver, CEO and president of the four-year-old startup in Irvine, Calif. Beaver said Wipro's experience includes reference code development and performance optimization for fixed-point and floating-point processors. 3DSP is offering a configurable, scalable DSP core for system-on-chip designs. The startup is lining up support for its core under a "Masterpiece" program that includes silicon foundry services at Hynix Semiconductor Inc. (formerly Hyundai Electronics) in South Korea (see May 15 story). Wipro Technologies is the global information technology business of Wipro Ltd., a 56-year-old supplier of IT services, software, consumer products and lighting systems that began as a producer of hydrogenated vegetable oil. Wipro's annual revenues exceed $650 million, and it employs more than 11,000 workers worldwide.
Related News
- Altera's Industry-proven Quartus II Software Delivers Up To 4X Faster Compile Times; Expands Support for 28-nm FPGAs
- Costs up at India's R&D centers
- Tensilica Partners with eInfochips to Set Up Software Development Center in India
- India's Wipro to support TI's OMAP processors for multimedia handsets
- Secafy selects Siemens' EDA tools for innovative hardware security development
Breaking News
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Xylon Introduces Xylon ISP Studio
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
Most Popular
- Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |