SynSense (formerly aiCTX) closes Series A Round and announces the opening of offices in China
May 6, 2020 -- SynSense (formerly aiCTX), the Zurich-based neuromorphic computing pioneer, has closed a Series A fundraising and will expand its footprint to China.
Led by CTC Capital, the latest round included co-investment from several strategic partners, including M Ventures, Ecovacs, and Yunding; and several financial investors, including CAS-Star and Archer Investment. Jade River Capital provides the financial advisory. The funds will fuel R&D and business development, accelerating the commercialization of SynSense’s neuromorphic computing technology.
Following the successful investment round, SynSense announced the opening of offices in China, and provided a roadmap to commercialization of their technology in China in 2020. SynSense has built R&D teams in Shanghai and Chengdu to make full use of the talent advantages and market opportunities of China.
“SynSense has been working hard in neuromorphic engineering for many years and has gained expertise. I am very optimistic about the future of neuromorphic computing and firmly believe that SynSense will be the first company to commercialize this technology”, Mr. Biao Zhang (Partner of CTC Capital) commented. “Together with our co-investors, we will support SynSense with resources to further strengthen its superiority in key sectors.”
Dr. Ning Qiao (CEO of SynSense) is confident in the prospects of SynSense’s next generation smart vision sensors in Smart Home and edge computing markets. “The next years will bring the golden age of neuromorphic computing. Our technology has resonated well with applications in Smart Homes, Robotics and Smart Surveillance. This fundraising round will help us sharpen our technology and achieve industrial penetration. We will grasp this unique chance to launch our products and seize the market”, said Dr. Ning Qiao.
|
Related News
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- SynSense closes strategic round to accelerate the development of their high-speed 3D neuromorphic processor DYNAP™-CNN2
- SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
- Eliyan Closes $40M Series A Funding Round and Unveils Industry's Highest Performance Chiplet Interconnect Technologies
- Algolux Closes $18.4 Million Series B Round for Robust Computer Vision
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |