Xilinx Ultra-Small CPLD Packaging Enables High Performance Sketchpad DSP Boards for 3DSP

SAN JOSE, Calif., January 29, 2003 - Xilinx, Inc., (NASDAQ:XLNX) today announced that 3DSP, a leading provider of configurable, scalable digital signal processor (DSP) architecture, used Xilinx chip scale packaged CoolRunner-II CPLDs, the industry's lowest power CPLD family, in its latest generation of SketchPad™ Development Boards. 3DSP Sketchpad Development Kits allow designers to optimize DSP core architecture and I/O configuration to match the needs of a specific application. 3DSP joins a growing number of companies using Xilinx low-cost CPLDs to gain a competitive advantage in today's high-performance, low-power applications.

"Xilinx CoolRunner-II CPLDs in chip-scale packaging gave us everything we needed in a CPLD in an ultra-small package, allowing us to minimize the size of our system without sacrificing performance," said June Jiang, Vice President of Engineering at 3DSP.

"3DSP's application of Xilinx CoolRunner CPLDs is a prime example of our increased penetration in low power CPLD applications," said Sandeep Vij, vice president of Worldwide Marketing at Xilinx. "The CoolRunner-II CPLD chip scale packaging provides companies like 3DSP with the advantages of programmable logic in the most compact form factor available in the industry."

Xilinx CoolRunner-II CPLDs offer the lowest power consumption, highest I/O count per macrocell, and smallest packaging in the industry and are cost optimized to address the pricing pressure of products designed for a broad spectrum of applications. Available in densities ranging from 32 to 512 macrocells, the CoolRunner-II family achieves performance of up to 333 MHz and pin-to-pin delays as fast as 3.0ns while providing a standby power of less than 33 microwatts (<33uW) ¾ an industry first.

The 3DSP Sketchpad Development Kit, comprising a Sketchpad FPGA development board, Software Studio™ development tools, power supply, and USB cables, is a complete development solution that allows designers to optimize and evaluate the SP-3™ , SP-5™ and SP-20 (UniPHY™) DSP architectures, prototype hardware and develop application software. The kit comes ready for USB plug-and-play use with a Windows™-based PC. For more information, visit www.3dsp.com/sketchpad.shtml

About 3DSP
3DSP develops and provides the only fully configurable DSP cores, configurable at all hardware levels down to the execution unit, instruction level configurable up to the creation of application specific instruction. All DSP cores are scalable and thus software compatible including upward compatibility throughout all core families. The performance of 3DSP's cores match today and tomorrow's requirements in such growing segments as broadband communication, audio and multimedia. For more information, visit www.3dsp.com.

About Xilinx
Xilinx, Inc. (NASDAQ: XLNX) is the worldwide leader of programmable logic solutions. Additional information about Xilinx is available at www.xilinx.com.

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