TSMC Ariz Fab a Tangled Web
By Junko Yoshida, EETimes (May 15, 2020)
Taiwan Semiconductor Manufacturing Co. (TSMC) is no Foxconn. Foxconn promised a big LCD fab in Wisconsin, but that ended up producing nothing but a photo opp for Terry Gou and Donald Trump.
“TSMC will deliver their promise.” That’s what I told my colleagues when we started to plot a game plan for EE Times’ editorial coverage of TSMC’s latest decision to build a 5nm fab in Arizona. Five hours later, reading stories filed by our colleagues from Taipei, I’m beginning to realize that we might be getting played by both TSMC and the U.S. government.
Judith Cheng, Chief Editor of EE Times & EDN Taiwan/Asia, pointed out in her story that TSMC, in announcing the company’s decision, cited TSMC’s “willingness” to set up a factory in the United States. Why not call it a “plan”?
It’s a subtle difference but it hints that negotiations between TSMC and the US and Arizona governments might be far from over. As our original news story by Taiwan correspondent Alan Patterson shows, TSMC didn’t disclose the terms of the agreement with Arizona and the United States.
Note, also, while the announcement says Arizona, it did not mention any specific city in Arizona. Why no names, if they are to begin building a fab in 2021?
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- TSMC Announces Updates for TSMC Arizona
- Awaiting a Deal, TSMC Chairman Reiterates Support for Arizona Fab
- ESMC Breaks Ground on Dresden Fab
- After TSMC fab in Japan, advanced packaging facility is next
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation