GRENOBLE, France - February 3, 2003 . . . Atmel® Corporation (Nasdaq: ATML) today announced the availability of two PowerPC microprocessor-based Multi-Chip Modules (MCM's) designed to fit in high performance, high-reliability, space sensitive applications. These products provide the user significant space savings in addition to increased performance.
The PC755M8 features a PowerPC 755B microprocessor along with 1 MByte of backside level-two (L2)-cache memory. The PC7410M16 features a PowerPC 7410 microprocessor, including the AltiVec™, 128-bit wide, vector processing unit, along with 2 MByte of backside L2-cache memory.
Both products are available in both Industrial (-40 to +110 degree Celsius) and Military (-55 to +125 degree Celsius) temperature range. Standard package is a 255-ball Ceramic Ball Grid Array (CBGA) that significantly reduces the motherboard design complexity and eliminates high-speed memory signal wiring.
These products are the first result of a fruitful agreement between Atmel Corporation and White Electronic Designs Corporation (Nasdaq: WEDC) that allows the two companies to cooperatively design, manufacture and market PowerPC-based Multi-Chip Modules to the Extended Reliability, Aerospace and Military markets.
Founded in 1984, Atmel Corporation is headquartered in San Jose, California with manufacturing facilities in North America and Europe. Atmel designs, manufactures and markets worldwide, advanced logic, mixed-signal, nonvolatile memory and RF semiconductors. Atmel is also a leading provider of system-level integration semiconductor solutions using CMOS, BiCMOS, SiGe, and high-voltage BCDMOS process technologies.
© Atmel Corporation 2003. All rights reserved. Atmel, the Atmel logo and combinations thereof are registered trademarks, and others contained herein are trademarks, of Atmel Corporation. AltiVec is a trademark of Motorola,inc. Other terms and product names in this document may be the trademarks of others.
For further information on Atmel's Hi-Rel MPU, go to http://www.atmel.com/atmel/acrobat/doc2164.pdf