MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
U.S. Chip Revival Gains Traction
By George Leopold, EETimes (June 15, 2020)
A new front has opened in efforts to revive U.S. chip manufacturing as lawmakers propose billions of dollars in spending and tax incentives to promote technology innovation across the entire semiconductor ecosystem — from post-Moore’s Law basic research to advanced chip packaging.
While the Trump Administration seeks to block China’s access to U.S. chip making equipment via export controls, the CHIPS for America Act — as in “Creating Helpful Incentives to Produce Semiconductors — proposes to revive domestic chip-making, fund R&D, and secure technology supply chains.
Aside from the marketing aspects, CHIPS for America also earmarks at least $12 billion to fund existing Pentagon electronics “resurgence” efforts while spreading $5 billion across other federal agencies for semiconductor R&D. The largest chunk — $5 billion — would fund an IC packaging and assembly institute. That effort also would also create a $500 million investment fund to support a “domestic advanced microelectronics packaging ecosystem.”
E-mail This Article | Printer-Friendly Page |
Related News
- Ex-DoD Official Says Chinese-Made PCBs Plague U.S. Systems
- Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs
- Largest CHIPS Act Awards Seen Coming for U.S. Companies
- Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain
- Analysts Debate Latest U.S. Export Controls
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024