NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
New Moortec Webinar - Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics
September 21, 2020 -- Register now for Moortec’s forthcoming webinar entitled ‘Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics’.
The development of High Performance Computing (HPC) solutions on a large scale for data centre platforms, targeting advanced node technologies poses many challenges associated with multi-processor and multi-accelerator architectures working on real-time high-computational workloads.
This webinar outlines these challenges by exploring the interplay between thermal management, power distribution, processing performance and reliable service provision at the micro level and how it can impact the decisions made when building extensive computing infrastructures.
The presentation covers the benefits that can be realised at the macro level by applying certain key approaches through the deployment of real-time embedded sensing fabrics, benefits of which include enhanced reliability of operation as well as dynamic power and speed optimisation. Descriptions will be provided of how such schemes allow for the hyper-scaling of data centres, the underpinning of mission-mode data telemetry and the creation of exciting new possibilities for big data analytics for technology product improvement.
Date & Time
The webinar is in partnership with SemiWiki.com and is taking place on Tuesday 13th October at 10am PDT / 6pm BST
Key Takeaways
- Gain an understanding of current challenges posed by large-scale HPC architectures implemented on the advanced nodes
- Understand ways to mitigate against the risks posed by such challenges
- Gain an insight to the future approaches of dynamic and static in-chip condition monitoring and its meaning to mission-mode lifetime assessment
Speakers
Richard McPartland, Technical Marketing Manager & Ramsay Allen, Marketing Manager
About Moortec
Moortec is the go-to leader for innovative in-chip monitoring technologies and sensing fabrics. The company is dedicated to maximizing performance, optimizing power utilization, and enabling highly accurate in-chip analytics across many sectors, including AI, Data Center, 5G & Consumer and Automotive applications.
|
Related News
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers
- CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software
- Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells
- Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |