Konstanz, Germany, February 12, 2003 - Hyperstone introduced today its RISC/DSP microprocessors in TFBGA packaging (E1-16XSB™, E1-32XSB™) and as a TSMC or UMC macro cell.
According to Dr. Matthias Steck, VP of Marketing and Sales, thanks to the TFBGA packaging customers benefit from Hyperstone's extremely small package sizes. The E1-16XSB measures only 9 x 9 x 1.2 mm, while the E1-32XSB measures only 12 x 12 x 1.2 mm. One of the first applications using these packages is a camera implemented in a wristwatch.
Hyperstone's RISC/DSP processor is also available as a macro cell for integration in customers' proprietary SoC designs. Customers have the flexibility to choose between TSMC's 0.18 µm process and UMC's 0.18 µm process. With 0.18 µm technology the processor can run up to 220 MHz achieving 220 MIPS or 880 MOPS, and a 1k Complex Fast Fourier Transformations is completed in less than 0.36 ms.
Due to the unified RISC/DSP architecture this outstanding performance is achieved with the highest energy efficiency of approximately 2445 MIPS / Watt. "This proven energy efficiency, together with our low-cost approach, makes our core the architecture of choice for all battery-run, cost-sensitive designs", said Dr. Steck. "Our extended portfolio offers customers the flexibility to begin their designs with the TFBGA packaged processor. Later, after increasing production volumes justify the change, customers may switch to an SoC design based on our core and realize even further cost savings."
Visit us at the Embedded World 2003 from February 18th to 20th in Nuremberg, Hall 12, booth 114.
For more details please visit the Hyperstone web site at: www.hyperstone.com
About Hyperstone AG
Hyperstone, a fabless semiconductor and microprocessor design company, was founded in 1990 and is based in Konstanz, Germany. With a subsidiary in Taiwan as well as representatives, distributors and design partners worldwide, Hyperstone serves a global customer base. Product development is based in Germany and Taiwan. World-leading silicon foundries provide wafer-subcontracting services. Products include microprocessors based on Hyperstone's unified RISC/DSP architecture and microcontrollers for flash memory solutions. The product scope ranges from packaged devices such as ASSPs (Application Specific Standard Products) and ASICs (Application Specific Integrated Circuits) to licensing of intellectual property (IP), reference designs and development support. Hyperstone's products and solutions target markets such as digital imaging, mobile networking, Internet appliances, flash memory solutions, communications, automotive and industrial solutions.