Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor'
A New Spin on Embedded Memory
SUNNYVALE, Calif., October 12, 2020 - Numem, the leading provider of NuRAM & SmartMem Smart Compute Memory IP Cores based on MRAM, has been selected for Phase I of the “DNN Radiation Hardened Co-processor as companion chip to NASA’s upcoming High-Performance Spaceflight Computing Processor” to enable AI processing.
This AI core developed with Numem’s Partners comprises of reconfigurable DNN Engine with multiple compute units which can support a wide range of DNN models and frame rates and a Numem NuRAM MRAM-based Memory enabling a 2-3x smaller memory area and 20x to 50x lower standby power than SRAM for low-power, highly efficient processing.
The on-board AI processing will enable spacecraft to efficiently process large volumes of raw sensor-data into scientific knowledge or actionable data to overcome limitations in downlink communication. It will also enable spacecraft to formulate decisions for critical operations. It will solidify HSPC avionics ecosystem with robust AI capabilities for space autonomy, small satellite constellations/autonomous science, human explorations and operations Habitat and deep space missions.
Numem ’s NuRAM and Smart Compute Memory (SmartMem) IP Cores are 2-3x smaller area and >20x lower leakage current than SRAM with the added advantage of being non-volatile and able to retain data in case of power failure or for low power operation.
Numem NuRAM and SmartMem provide an excellent memory solution for IoT Wearables, Microcontroller, AI /Neuromorphic, Storage, Autonomous Vehicle, Digital Security Cameras and in general SoC Designs requiring ultra-low power or high-density memories, in addition to Space and Defense applications requiring radiation hardened AI microelectronics. They can also be used as lower power/higher endurance/higher performance eFlash, or OTP for permanent data such as PUF/Root of Trust for Security Applications.
|
Related News
- Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance Computing SoC
- Synopsys' Silicon-Proven DesignWare DDR IP for High-Performance Cloud Computing Networking Chips Selected by NVIDIA
- Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs
- Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
- AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader
Breaking News
- Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
- Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
- Industry R&D Spending To Rise 4% After Hitting Record in 2020
- Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements
- Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
Most Popular
- TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
- TSMC Boosts Capital Expenditure Budget on Strong Outlook
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
- Value of Semiconductor Industry M&A Agreements Sets Record in 2020
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |