Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
October 20, 2020 -- T2MIP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the availability of a comprehensive range of Silicon Proven SERDES Phy IPs in TSMC’s advance 12FFC process technology.
TSMC's 12nm FFC process supplies the best in-class performance, providing superior speed increase and significant power consumption reduction for next generation high-end mobile computing, network communication, consumer and automotive electronic applications.
The SERDES Phy IPs are available pre-integrated with a matching digital Controller IP Cores to deliver a seamless integration experience or can be integrated with 3rd party or in-house Controller IP Cores.
The following SERDES IP Cores are available silicon proven in TSMC12FFC:
DISPLAY | MEMORY |
In addition to Interfaces T2MIP also has a complete portfolio of Demodulator & Decoder IP cores for TV, STB & Satellite SoCs, licenced as White Box IPs along with DVB-S2X WideBand, DVB-S2X Narrow Band, DVB-S2/S, DVB-T2/T, DVB-C, ATSC, DTMB, Analog TV, DOCSIS, MOCA.
These solutions are based on the successful implementation by customers based in China, USA, Taiwan, Europe and Japan where they have been used in high-volume production for TV & STB SoCs, PC-oriented SoCs, Mobile SoCs and high -end Video & Graphic applications.
Availability
These SERDES IPs are available for immediate licensing stand alone or with the matching Controllers. For more information on licensing options and pricing please drop a request to contact@t-2-m.com.
About T2M
T2MIP is the global independent semiconductor technology provider, supplying complex IP Cores, software, KGD and disruptive technologies enabling accelerated development of your storage, servers, networking, communications, TV, STB, Satellite and add-on PC cards SoCs. For more information, please visit: https://www.t-2-m.com/.
|
T2M Hot IP
GNSS Ultra low power (GPS, Galileo, GLONASS, Beidou3, QZSS, IRNSS, SBAS) Digital ...
USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP, Silicon Proven in TSMC 28HPC+
DVB-S2X WideBand Demodulator & Decoder IP (Silicon Proven)
MIPI D-PHY Tx IP, Silicon Proven in TSMC 22ULP
Wi-Fi 802.11 ax/Wi-Fi 6 /Bluetooth LE v5.4/15.4-2.4GHz RF Transceiver IP for IOT ...
Related News
- DDR5/DDR4/LPDDR5 Combo PHY IP Cores which is Silicon Proven in 12FFC with Matching Controller IP Cores is available for license to accelerate your Memory Interfacing Speeds
- USB, MIPI, Ethernet, DisplayPort, PCIe, DDR, HDMI, ONFi Analog Phy IP Cores silicon proven in UMC 28nm & UMC 40nm Process
- HDMI 2.1 Rx PHY (TSMC 12FFC) & Controller Semiconductor IP licensed to a Tier1 Chinese Semiconductor company for integration into a TV SOC by T2MIP
- Elevate Your Display and Camera SOC Capabilities with our latest Silicon Proven MIPI C-D Combo Tx/Rx PHY and DSI Controller IP Cores
- Upgrade Your Display and Camera SOC's with proven MIPI C-D Combo PHY and CSI / DSI Controller IP Cores for both Tx and Rx
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |