TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
Hsinchu, Taiwan, R.O.C. – Oct. 20, 2020 – TSMC (TSE: 2330, NYSE: TSM) today recognized the outstanding achievements of 10 EDA, IP, and Cloud Alliance partners with the distinction of OIP Partner of the Year. The OIP Partner of the Year awards honor TSMC Open Innovation Platform® (OIP) ecosystem partners demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement over the past year. As the key force enabling innovation and reducing time to market for IC designers, these ecosystem partners have collaborated closely with TSMC to help customers reduce design barriers and achieve first-time silicon success.
“TSMC appreciates each of our partners for their continued collaboration to help our customers unleash silicon innovations with fast time-to-market. Their tremendous efforts have led to a flourishing design ecosystem for TSMC’s latest technologies, providing easier access to the most advanced foundry solutions available,” said Dr. Y. J. Mii, Senior Vice President of Research & Development and Technology Development at TSMC. “I’m pleased to congratulate the winners of the 2020 TSMC OIP Partner of the Year awards and look forward to our continued partnerships to address customers’ design challenges and extend the development of PPA-optimized design platforms for smartphone, HPC, automotive, AI/ML and IoT applications.”
TSMC values ecosystem partners and continues working with them to enable next-generation SoC and 3DIC designs with certified solutions and services using TSMC’s latest technologies. The title of OIP Partner of the Year is awarded to partner companies achieving the highest standards of design, development, and technology implementation to accelerate silicon innovation. The companies recognized with the 2020 TSMC OIP Partner of the Year awards are as follows:
The IP Alliance award winners
• Analog/Mixed Signal IP: Silicon Creations
• DSP IP: Cadence Design Systems, Inc.
• Embedded Memory IP: eMemory Technology Inc.
• High-Speed SerDes IP: Alphawave IP
• Interface IP: Synopsys, Inc.
• Processor IP: Arm Ltd.
• Specialty Process IP: M31 Technology
The EDA Alliance award winners
• Joint Development of 3nm Design Infrastructure:
- ANSYS
- Cadence Design Systems, Inc.
- Mentor
- Synopsys, Inc.
• Joint Development of 3DIC Design Productivity Solution:
- ANSYS
- Cadence Design Systems, Inc.
- Mentor
- Synopsys, Inc.
The Cloud Alliance award winners
• Joint Development of Timing Sign-Off in the Cloud Design Solution:
- Cadence Design Systems, Inc.
- Microsoft Corp.
- Synopsys, Inc.
About TSMC Open Innovation Platform® (OIP)
TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners under the common goal of shortening design time, time-to-volume, time-to-market and ultimately, time-to-revenue. The TSMC OIP features the most comprehensive design ecosystem alliance programs covering industry-leading EDA, library, IPs, Cloud, and design service partners. With over 20 years’ experience of working with these ecosystem partners, TSMC continues to expand its libraries and silicon IP portfolio to more than 28,000 IP titles and provides more than 12,000 technology files and over 450 process design kits, from 0.5-micron to 3-nanometer, to customers via TSMC-Online.
|
Related News
- Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
- Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions
- Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
- eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
- M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
Breaking News
- Expedera Introduces Its Origin Neural Engine IP With Unrivaled Energy-Efficiency and Performance
- PLDA Introduces a Complete Line of PCIe IP for USB4, Enabling PCIe Support in USB4 Hubs, Hosts and Devices
- DSP Concepts Enables Audio Weaver for the Cadence Tensilica HiFi 5 DSP
- Logic Design Solutions Introduces the first NVMe HOST IP on POLARFIRE SoC FPGA
- TSMC Boosts Capital Budget Again, to $30B
Most Popular
- Synopsys To Expand DesignWare Ethernet IP Portfolio with Acquisition of MorethanIP
- Siemens expands industry-leading IC verification portfolio through acquisition of OneSpin Solutions
- Arm and NVIDIA: Fueling Innovation for the Next Era of Compute
- OpenFive Tapes Out SoC for Advanced HPC/AI Solutions on TSMC 5nm Technology
- Avery Design Debuts CXL 2.0 System-level VIP Simulation Solution
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |