QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process
SAN JOSE, Calif., Oct. 28, 2020 -- QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, today announced the availability of its ArcticPro™ 3 embedded FPGA (eFPGA) IP, which is now available on Samsung's 28nm FD–SOI process, enabling OEMs and semiconductor companies to seamlessly integrate the capability of discrete FD-SOI FPGAs into their own ASICs/SoCs, greatly optimizing system performance, power consumption and cost for Edge AI use cases in consumer, IoT, and automotive applications.
QuickLogic's ArcticPro 3 eFPGA IP has been designed from the ground up on the Samsung 28FDS process, resulting in a significant boost in performance and delivering ultra-low standby current leakage. The 28FDS process supports body biasing, enabling OEMs and semiconductor companies the ability to "dial in" the ideal performance/power consumption parameters to meet their system requirements.
The ArcticPro 3 IP is developed with a homogenous, reprogrammable fabric architecture based on SLCs (Super Logic Cells), which consist of eight LUT4 + Register blocks, and it uses a hierarchical routing scheme that strikes the optimum performance and power consumption balance needed for computation heavy, battery powered or other power sensitive products. In addition to the logic fabric, the eFPGA IP includes the option to integrate fixed function blocks such as embedded RAM and fracturable Multiply-Accumulate (MAC) blocks to efficiently implement hardware accelerators for neural networks and other computationally intensive circuits foundational in AI/ML applications. ArcticPro 3 is supported by QuickLogic's proprietary tools as well as the ground-breaking QuickLogic Open Reconfigurable Computing (QORC) vendor-supported open source FPGA development tools, giving designers full control over their system software development environment.
Over the past three decades, QuickLogic's eFPGA IP has been implemented in numerous SoCs, MCUs, and discrete FPGAs, and shipped in millions of units into multiple end markets such as consumer, IoT, military, and industrial.
"The flexibility inherent in programmable logic is widely recognized as making it an ideal technology for accelerating AI applications," said Mao Wang, senior director of product management at QuickLogic. "However, discrete FPGAs are often too expensive for volume applications and getting data into and out of FPGAs decreases system performance. With today's announcement, companies using Samsung's 28FDS process can now integrate the ArcticPro 3 eFPGA into their own SoC, eliminating the need to use discrete FD-SOI-based FPGAs – saving BOM cost, power consumption, and optimizing system performance."
Availability
QuickLogic's ArcticPro 3 eFPGA technology on Samsung's 28nm FD–SOI process is available now. For more information, please visit https://www.quicklogic.com/products/efpga/arcticpro-3.
About QuickLogic
QuickLogic Corporation (NASDAQ: QUIK) is a fabless semiconductor company that develops low power, multi-core semiconductor platforms and Intellectual Property (IP) for Artificial Intelligence (AI), voice and sensor processing. The solutions include embedded FPGA IP (eFPGA) for hardware acceleration and pre-processing, and heterogeneous multi-core SoCs that integrate eFPGA with other processors and peripherals. The Analytics Toolkit from our recently acquired wholly-owned subsidiary, SensiML Corporation, completes the end-to-end solution with accurate sensor algorithms using AI technology. The full range of platforms, software tools and eFPGA IP enables the practical and efficient adoption of AI, voice, and sensor processing across mobile, wearable, hearable, consumer, industrial, edge and endpoint IoT. For more information, visit www.quicklogic.com and https://www.quicklogic.com/blog/.
|
QuickLogic Corp. Hot IP
Related News
- QuickLogic Announces Silicon-Proven ArcticPro eFPGA on GLOBALFOUNDRIES 22FDX Process
- QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process
- QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process
- QuickLogic Unveils Customizable eFPGA IP on GlobalFoundries' 12LP Process
- QuickLogic Adds GlobalFoundries 22FDX Process to its Growing List of Australis IP Generator-Based eFPGA IP
Breaking News
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |