Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Rambus Unveils Redwood, the Industry's Fastest Parallel Bus Logic Interface
Interface family is capable of running up to ten times faster than best-of-class processor busses with backward compatibility to existing standards
INTEL DEVELOPER FORUM, SAN JOSE, CA, Feb. 17, 2003 - Rambus Inc. (Nasdaq: RMBS), a leading developer of chip-to-chip interface products and services, today introduced its parallel bus logic interface family, codenamed Redwood. Ideal for high volume, low-cost systems, the Redwood family of interface products offers a per pin data rate of 400MHz to 6.4GHz, enabling it to run up to ten times faster than best-of-class processor busses available today.
The Redwood parallel bus interface family addresses intra-board applications including processor, chipset and network chip connections. It is optimized for low latency and low power parallel bus applications, and enables the highest-pin bandwidth to reduce overall package, board, and system costs. Additionally, Redwood can be backwards compatible with existing LVDS-based standards such as HyperTransport, SPI-4 and RapidIO, allowing for easy integration into next-generation products. In order to achieve backwards compatibility, Redwood offers customers a range of frequency and voltage support.
"Redwood technology is a perfect addition to our portfolio of logic interface solutions as it provides our customers with high performance, parallel bus connections that complement our RaSer family of high-performance serial link interfaces," said Kevin Donnelly, vice president of Rambus' Logic Interface Division. "Furthermore, Redwood's flexible and scalable architecture allows us to customize solutions to further enhance the performance of our customers' products."
Elements integrated into the Redwood technology include a 400 MHz-6.4 GHz data rate range, low-voltage differential signaling, backwards compatibility with existing standards, FlexPhase timing calibration circuit technology, and dynamic current and termination capabilities. Combined, all of these technologies allow Redwood to achieve up to 6.4 GHz speeds for low-cost systems.
The Redwood family of parallel bus logic interfaces is available now for licensing. Rambus will be disclosing more technical detail and usage of Redwood at the Intel Developer Forum on Thursday, February 20 at 3:30 pm at the San Jose Convention Center. Additional information on Redwood can be found at www.rambus.com/products/redwood.
About Rambus Inc.
Rambus is a leading provider of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging interface problems and bring industry-leading products to market. Rambus' interface solutions can be found in hundreds of computing, consumer electronic and networking products. Additional information on Rambus and its technology is available at www.rambus.com.
Rambus is a registered trademark and Redwood and FlexPhase are trademarks of Rambus Inc. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.
|
Related News
- Toshiba and Rambus to Demonstrate World's Fastest Parallel Interface at Microprocessor Forum
- Altera Unveils Industry's Fastest Programmable Logic HyperTransport Interface
- Elpida, Toshiba claim world's fastest DRAMs based on the XDR memory interface technology from Rambus Inc
- LSI Logic Unveils Industry's Highest Speed DDR-2 SDRAM Physical Layer Memory Interface
- Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |